Corsair 16GB DDR4 3200 Desktop Memory Module Avengers LPX Series Single Module

Ukusebenza okuphezulu: Inkumbulo isebenzisa izinhlayiya zekhwalithi ephezulu futhi iklanywe ngokucophelela ukuze inikeze ukusebenza okuhle kakhulu, okufanele izinhlelo zokusebenza nemidlalo edinga ukusebenza okuphezulu.

Ukubambezeleka Okuphansi: Inkumbulo ye-LPX ivamise ukuba ne-latency ephansi, ethuthukisa ukuphendula kwesistimu futhi yenze izinhlelo zokusebenza zibe bushelelezi.

Xhumana nathi

imininingwane yomkhiqizo

Incazelo

Idizayini yokukhipha ukushisa:Amamojula enkumbulo ye-LPX amukela idizayini enhle kakhulu yokulahla ukushisa ukuze aqinisekise ukusebenza okuzinzile ngaphansi komthwalo omkhulu futhi andise impilo yomkhiqizo.

Ukusekelwa kwe-XMP:Isekela ubuchwepheshe be-Intel Extreme Memory Profile (XMP), obungakwazi ukufeza i-overclocking kalula futhi buthuthukise ukusebenza kwememori.

Izinketho eziningi zamandla nemvamisa:Uchungechunge lwe-LPX luhlinzeka ngezinketho ezihlukahlukene zomthamo kanye nemvamisa ukuze kuhlangatshezwane nezidingo zabasebenzisi abahlukene, kusukela emsebenzini wansuku zonke wasehhovisi kuya kumageyimu asezingeni eliphezulu.

Ukuthembeka Nokuqina:Uchungechunge lwe-LPX luhlolwe ngokuqinile ukuze kuqinisekiswe ukusebenza okuzinzile nokuthembekile futhi kwethenjwa ngabasebenzisi.

Ukubukeka:Inkumbulo ye-LPX ifaka idizayini ehlanzekile, ngokuvamile ene-PCB emnyama nosinki wokushisa, okuyenza ifaneleke ukwakhiwa kwetimu ehlukahlukene.

Idizayinelwe ukusebenza okuphezulu kwe-overclocking

Inkumbulo ye-LPX yakhelwe ukusebenza okungaphezulu kwe-overclocking. I-heatsink yenziwe nge-aluminium ehlanzekile ukuze ikhiphe ukushisa ngokushesha, kuyilapho i-PCB yokusebenza yangokwezifiso isiza ukulawula ukushisa futhi inikeze i-headroom eyanele yokweqa ngaphezulu. I-IC ngayinye ihlolwa iyodwa ukuze kubonwe amandla okusebenza okuphezulu.

I-radiator ye-aluminium

Izindleko ze-overclocking zinqunyelwe izinga lokushisa lokusebenza. Idizayini eyingqayizivele yosinki wokushisa we-LPX ithwala ngempumelelo ukushisa ukusuka ku-IC ukuyise endleleni yokupholisa yesistimu, okukuvumela ukuthi uyichithe.

Idizayinelwe ukusebenza okuphezulu kwe-overclocking

Imojuli ngayinye ye-LPX yakhiwe nge-PCB yokusebenza yangokwezifiso kanye nama-IC enkumbulo ahlolwe kakhulu. I-heatsink esebenza kahle ihlinzeka ngokupholisa okuphumelelayo ukuze kuthuthukiswe amandla okusebenzisa i-overclocking.

Izimfanelo Ezibalulekile

Kufakwe abalandeli: Cha

Umbala Wenkumbulo: EMNYAMA

Ukuhambisana kweMemori: Intel 200 Series,Intel 300 Series,Intel 400 Series,Intel 500 Series,Intel 600 Series,Intel X299,AMD 300 Series,AMD 400 Series,AMD 500 Series,AMD X570

Ukuhambisana Kwemininingwane Yenkumbulo: Intel 200 Series,Intel 300 Series,Intel 400 Series,Intel 500 Series,Intel 600 Series,Intel X299,AMD 300 Series,AMD 400 Series,AMD 500 Series,AMD X570

I-Heat Spreader: I-Anodized Aluminium

Uchungechunge lweMemori: OEM LPX
Usayizi Wenkumbulo: 16GB (2 x 8GB)

Uhlobo Lwenkumbulo: DDR4

Ifomethi Yememori Yephakheji: DIMM

Iphinikhodi Yememori Yephakheji: 288

Iphrofayili Yokusebenza: XMP 2.0

Ukubambezeleka kwe-SPD: 15-15-15-36
Isivinini se-SPD: 2133MHz

I-SPD Voltage: 1.2V

Ukubambezeleka Okuhloliwe: 16-18-18-36

Isivinini Esihloliwe: 3200 MT/s

Amandla kagesi ahloliwe: 1.35V

Isisindo: 0.11